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| CYLINDRICAL GENERAL PURPOSE SURFACE MOUNT POWER RESISTOR METAL GLAZETM ISO-9001 Registered MM SERIES * * * * Up to 2 watts 0.1 ohm to 2.2 megohm range Up to 1000 volts 150C maximum operating temperature Size Code B F H 1 Metal GlazeTM thick film element fired at 1000C to solid ceramic substrate High temperature dielectric coating 60/40 Solder over nickel barrier MM SPECIFICATIONS: IRC Type MMA0204 MMB0207 MMC0310 Maximum Power Rating 1/4W @ 70C 1W @ 70C 2W @ 25C 1.33W @ 70C Working Maximum Voltage1 200 350 500 Voltage 400 700 1000 Resistance Range (ohms)2 0.1 to 0.99 1.0 to 1.0 M 0.1 to 0.99 1.0 to 2.21M 0.2 to 0.99 1.0 to 2.21M Tolerance (%)2 1 1 1 1 1 1 TCR (ppm/C)2 100 50 100 50 100 50 Product Category Low Range Standard Low Range Standard Low Range Standard Not to exceed PxR 2Consult factory for tighter TCR, tolerance, or resistance values. E96 standard EIA Decade Values preferred. E196 and E24 Decade Values available. MM PERFORMANCE CHARACTERISTICS: Characteristics Temperature Coefficient Thermal Shock Low Temperature Operation Short Time Overload High Temperature Exposure Resistance to Bonding Exposure Solderability Moisture Resistance Life Test Terminal Adhesion Strength Resistance to Board Bending Maximum Change As specified 0.5% +0.01 ohm 0.25% +0.01 ohm 1% +0.01 ohm 0.5% +0.01 ohm 0.25% 0.01 ohm 95% minimum coverage 0.5% +0.01 ohm 1% +0.01 ohm 1% +0.01 ohm no mechanical damage 1% + 0.01 ohm no mechanical damage Test Method MIL-R-55342E Par 4.7.9 (-55C +125C) MIL-R-55342E Par 4.7.3 (-65C +150C, 5 cycles) MIL-R-55342E Par 4.7.4 (-65C @ working voltage) MIL-R-55342E Par 4.7.5 (2.5 x PxR for 5 seconds) MIL-R-55342E Par 4.7.6 (+150C for 100 hours) MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260C for 10 seconds) MIL-STD-202, Method 208 (245C for 5 seconds) MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours) MIL-R-55342E Par 4.7.10 (2000 hour at 70C intermittent) 1200 gram push from underside of mounted chip for 60 seconds Chip mounted in center of 90mm long board, deflected 5mm so as to exert pull on chip contacts for 10 seconds www..com MM POWER DERATING CURVE: 120% MM REPETITIVE SURGE CURVE: 1000 100% Percent Relative Power Peak Power (watts) CHP 1/8, 1/2, 1 MMA0204, MMB0207 80% MMC0310 100 MMB0207 60% CHP 2 MMC0310 40% MMA0204 10 20% 0% 30 40 50 60 70 80 90 100 110 120 130 140 150 1 0.0001 .1msec 0.0010 1msec 0.0100 10msec 0.1000 100msec 1.0000 10000msec Ambient Temperature (C) Surge or Pulse duration (seconds) Note: Use for repetitive pulses where the average power dissipation is not to exceed the component rating at 70C. Surge handling capacity for lowrepetitive surges may be significantly greater than shown above. Contact factory for recommendations. WIREWOUND AND FILM TECHNOLOGIES DIVISION 736 Greenway Road * Boone, North Carolina 28607-1860 * Tel: 828-264-8861 * Fax: 828-264-8866 * www.irctt.com 1 ISO-9001 Registered MM FAMILY STANDARD SIZES, SOLDER PADS AND PACKAGING: DIMENSIONS (mm and (inches)): L C W Size Code B F H Actual Size L 3.250.18 (0.1280.007) 6.380.25 (0.2510.010) 9.320.25 (0.3670.010) W 1.450.15 (0.0570.006) 2.010.15 (0.0790.006) 2.670.15 (0.1050.006) C* 0.51+0.50/-0.38 (0.020+0.020/-0.015) 1.020.50 (0.0400.020) 1.270.50 (0.0500.020) *C dimension is average termination width. RECOMMENDED SOLDER PAD DIMENSIONS (REFLOW): To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a large repeatable solder fillet to the MM resistor on reflow processes and will provide maximum heat transfer to the PC board in high power applications. By placing the MM on the solder paste while the paste is in the "tacky" state, the MM will be held in position until solder reflow begins. The pad design then uses the surface tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising above the board level directly beneath the MM is not recommended. Size Code B www..com Dimensions (mm and (inches)) A 1.93 (0.076) 3.07 (0.121) 4.32 (0.170) B 2.36 (0.093) 3.20 (0.126) 4.06 (0.160) C 1.47 (0.058) 3.23 (0.127) 5.41 (0.213) D 2.49 (0.098) 4.65 (0.183) 6.93 (0.273) E 0.81 (0.032) 1.02 (0.040) 1.12 (0.044) F 5.36 (0.211) 9.37 (0.369) 14.05 (0.553) A B E F C A F H D STANDARD REEL PACKAGING PER EIA-481: Size Code B F H Reel Diameter* 7" 13" 7" 13" 13" Quantity Per Reel 2,500 max. 10,000 max. 1,500 max. 5,000 max. 1,500 max. 24mm 4mm Carrier Tape Width 8mm 12mm Component Pitch 4mm 4mm * The 13" reel is considered standard and will be supplied unless otherwise specified. HOW TO ORDER: Sample Part No. IRC Type (MMA0204, MMB0207, MMC0310) MMA0204 - 50 - 2203 - F - 13 Temperature Coefficient (50 or 100) Resistance Value (100 ohms and greater - First 3 significant figures plus 4th digit multiplier) Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503 (Less than 100 ohms - "R" is used to designate decimal) Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohm = R250 Tolerance (F = 1.0%) Packaging Code* (BLK = Bulk, 7=7" Reel, 13=13" Reel) 2 WIREWOUND AND FILM TECHNOLOGIES DIVISION 736 Greenway Road * Boone, North Carolina 28607-1860 * Tel: 828-264-8861 * Fax: 828-264-8866 * www.irctt.com |
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